CONTACT DESIGN


Image of 1mm contact wipe

EdgeRate® contact design minimizes broadside coupling and crosstalk.

SELF-ALIGNMENT


Animation of solder ball

The ball grid array termination allows the connector to self-align during board reflow.

DENSITY AND PERFORMANCE


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Accelerate® HD packs up to 400 I/Os in a slim 5 mm strip while achieving 56 Gbps PAM4 performance.